供應(yīng)廣和通L860-GL 通信模塊

基本特性 dimension(mm):42.00 x 30.00 x 2.30
package:m.2 lte fdd:b1/b2/b3/b4/b5/b7/b8/b12/ b13/b14/b17/b18/b19/b20/b21/b25/ b26/b28/b29/b30/b32/b66 lte tdd:b38/b39/b40/b41/b42 wcdma:b1/b2/b4/b5/b8 power supply:3.135v~4.4v(typical3.3v)
operating temp.:-10℃~+55℃
接口 sim:x 2, 1.8v/3.0v pcie: gpio: